- Catherine

FiberMall
Answered on 2:30 am
Optical transceivers such as OSFP (Octal Small Form Factor Pluggable) and QSFP-DD (Quad Small Form Factor Pluggable Double Density) are integral to significant high-speed, high-density networking applications in data centers and telecommunications. Dealing with new network speeds and managing bandwidth needs, different factors might lead to a preference for one over the other.
Before listing the pros and cons, it is important to note the crucial differences between them:
1. Form Factor: OSFP is larger than QSFP-DD, resulting in a lower port density. However, this larger size allows OSFP to handle higher wattage, providing better heat dissipation and therefore potentially higher bandwidth per port in the future.
2. Compatibility: QSFP-DD was designed with backward compatibility with QSFP28 in mind. You can use existing QSFP28 cables and modules in a QSFP-DD port.
Now, let’s discuss some of the pros and cons:
OSFP
Pros:
1. Higher Power Handling: OSFP can handle higher power up to 15W, accommodating future bandwidth needs. There is the potential to reach up to 800Gbps for future uses.
2. Thermal Efficiency: The larger form factor leads to better heat dissipation, which may become increasingly important as connections’ power utilization and density increase.
Cons:
1. Low Port Density: Due to their larger size, data center rack units fitted with OSFP ports have a lower overall port density compared to those using QSFP-DD.
2. No Backward Compatibility: OSFP is not backward compatible with existing form factors, which can complicate upgrades and increase costs.
QSFP-DD
Pros:
1. Backward Compatibility: QSFP-DD is backward compatible with QSFP, and QSFP28 modules. This allows for easier upgrading while lowering costs by reusing existing hardware.
2. High Port Density: The smaller QSFP-DD form factor allows for more ports on a single switch, leading to a more compact and dense arrangement which can save precious space in data centers.
Cons:
1. Lower Power Handling: QSFP-DD power handling is lower than OSFP, making it harder to scale for future increased transmission rates.
2. Thermal Concerns: Due to the high port density and higher power demand for future standards, managing thermal dissipation may become a challenge.
The choice between QSFP-DD and OSFP will depend on your specific circumstances and long-term network goals. If you have existing QSFP infrastructure and you’re seeking a high-density configuration with measured growth in mind, QSFP-DD is a solid choice. If, however, you’re preparing for immense growth and want to set up your data center for future advancements (especially those requiring high power and efficient thermal handling), OSFP could be the better choice.
People Also Ask
Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.
Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.
Mastering SONiC: 6 Essential Points to Grasp for Open Networking Success
SONiC (Software for Open Networking in the Cloud) is an open-source network operating system that differs significantly from other network operating systems you’ve encountered before. Learning SONiC requires new mental preparation and skill reserves. As a new operating system that fundamentally transforms network architecture, the following key insights and abilities
Detachable Fiber Connection Technology in CPO Systems
In the rapidly evolving world of high-speed data communication, Co-Packaged Optics (CPO) technology stands out as a game-changer. By integrating optical and electronic devices into a single package, CPO overcomes the bandwidth limitations of traditional electrical interconnects. At the heart of a successful CPO system lies a critical component that
NVIDIA Launches Spectrum-XGS Ethernet Technology: From Scale-Up/Out to Cross-Domain Scaling!
In the lead-up to the 2025 Hot Chips conference, NVIDIA officially unveiled the Spectrum-XGS Ethernet technology. This innovative solution, based on network optimization algorithms, introduces “scale-across” capabilities, breaking through the power and space physical limitations of single data centers. It connects multiple data centers distributed across different cities and countries
1.6 T Optical Module Production Line TX Parallel Testing: A Comprehensive Guide
In the fast-paced realm of high-speed optical communications, major optical module manufacturers are leveraging 4-channel optical sampling oscilloscopes to enhance TX testing efficiency for 400G, 800G, and 1.6 T modules. However, due to the architectural differences between 4-channel and single-channel TX testing, extra attention to details is essential. Otherwise, even after
Related Articles

800G SR8 and 400G SR4 Optical Transceiver Modules Compatibility and Interconnection Test Report
Version Change Log Writer V0 Sample Test Cassie Test Purpose Test Objects:800G OSFP SR8/400G OSFP SR4/400G Q112 SR4. By conducting corresponding tests, the test parameters meet the relevant industry standards, and the test modules can be normally used for Nvidia (Mellanox) MQM9790 switch, Nvidia (Mellanox) ConnectX-7 network card and Nvidia (Mellanox) BlueField-3, laying a foundation for

Hotchip 2025 Day 0 Tutorials: Essential Insights on AI Workloads, Rack Architectures, and Custom GB200 Solutions
In the ever-evolving world of AI and data center technologies, Hotchip 2025 kicked off with an enriching Day 0 Tutorials lineup. As a staple event in the industry, this year’s sessions served as an appetizing prelude, focusing on data center racks in the morning and kernel programming in the afternoon.

Deep Dive into NVIDIA GB200 Liquid Cooling Plate Design: Advanced Liquid Cooling for AI Chips
Next-generation AI chips like NVIDIA’s GB200 are pushing the boundaries of performance. But this immense power comes at a cost: staggering heat generation. A single GB200 chip package consumes up to 2700 W of power. With such high power in such a compact space, traditional air-cooling systems simply can’t keep up.

Mastering SONiC: 6 Essential Points to Grasp for Open Networking Success
SONiC (Software for Open Networking in the Cloud) is an open-source network operating system that differs significantly from other network operating systems you’ve encountered before. Learning SONiC requires new mental preparation and skill reserves. As a new operating system that fundamentally transforms network architecture, the following key insights and abilities

Detachable Fiber Connection Technology in CPO Systems
In the rapidly evolving world of high-speed data communication, Co-Packaged Optics (CPO) technology stands out as a game-changer. By integrating optical and electronic devices into a single package, CPO overcomes the bandwidth limitations of traditional electrical interconnects. At the heart of a successful CPO system lies a critical component that

NVIDIA Launches Spectrum-XGS Ethernet Technology: From Scale-Up/Out to Cross-Domain Scaling!
In the lead-up to the 2025 Hot Chips conference, NVIDIA officially unveiled the Spectrum-XGS Ethernet technology. This innovative solution, based on network optimization algorithms, introduces “scale-across” capabilities, breaking through the power and space physical limitations of single data centers. It connects multiple data centers distributed across different cities and countries

1.6 T Optical Module Production Line TX Parallel Testing: A Comprehensive Guide
In the fast-paced realm of high-speed optical communications, major optical module manufacturers are leveraging 4-channel optical sampling oscilloscopes to enhance TX testing efficiency for 400G, 800G, and 1.6 T modules. However, due to the architectural differences between 4-channel and single-channel TX testing, extra attention to details is essential. Otherwise, even after